To provide a method and a device for inspecting solder wettability with a simple device configuration in a short process time.

In a reference contact angle determining process and an inspection light inclination setting process as preparation processes, a contact angle as a reference is determined in advance, and the radiation angle of the inspection light emitted from the light source of a light-source integrated camera is so set as to be vertical to the plane corresponding to the contact angle. The inspection light which is aligned for setting an inclination in a light source shifting process is radiated to the surface of a solder fillet which is to be inspected. The surface of the solder fillet is imaged in a fillet surface imaging process. The image is processed for binarizing or the like in an image processing process. The solder wettability is judged based on the process result in a solder wettability evaluation process.

COPYRIGHT: (C)2007,JPO&INPIT