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Title:
METHOD AND DEVICE FOR FORMING AND SUPPLYING LINEAR SOLDER
Document Type and Number:
Japanese Patent JPH0270344
Kind Code:
A
Abstract:

PURPOSE: To quickly execute forming by supplying linear solder in the tangential direction to the outside periphery of a static forming die, holding it by a holding device and the die, cutting it to prescribed length, moving a movable forming die and forming the linear solder like a ring by the static forming die and the movable forming die.

CONSTITUTION: Linear solder (h) is supplied in the tangential direction to the outside periphery of a cylindrical part 21 of a static forming die 2 from a supply device 5. Subsequently, a movable frame 41 of a driving mechanism 4 advances and the linear solder (h) is fed in between a movable forming die 3 of the tip of a pair of forming arms 42 and the static forming die 2. When the solder (h) is supplied, the solder is held by a rod 61 of a holding device 6 and the static forming die and cut at a prescribed position by a cutter 53. When the movable frame 41 moves in the direction as indicated with an arrow X, since it is drawn by a spring 44, the movable forming die 3 forms the solder (h) in the outside periphery of the static forming die 2. When forming is completed, the rod 61 moves backward and releases holding of the solder (h). In such a way, forming of the solder can be executed quickly.


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Inventors:
OKADA MASAAKI
Application Number:
JP21947488A
Publication Date:
March 09, 1990
Filing Date:
September 01, 1988
Export Citation:
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Assignee:
CKD CORP
International Classes:
B21F23/00; B21F37/00; B23K35/40; H01K3/16; (IPC1-7): B21F23/00; B21F37/00; B23K35/40; H01K3/16
Domestic Patent References:
JPS6213266A1987-01-22
Attorney, Agent or Firm:
Kyozo Yuasa (4 outside)



 
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