To enable a bonding wire route based on a reference to be quickly generated by considering information on an IO buffer of a semiconductor IC device and a reference of the bonding wire packaging.
A bonding wire route generation part 23 calculates positions of an IO buffer and the corresponding bonding pad from information in a base array storage part 21a and a lead frame storage part 21b and further calculates the optimum pair of combination of the bonding pad and the corresponding lead. When an arithmetic circuitry 23a of the bonding wire route generation part 23 judges that a group of bonding wire routes obtained from a pair of combination of the bonding pad and the lead satisfy a package reference value of the bonding wire route, the bonding wire route generation part 23 regards the pair of bonding wire routes as the optimum bonding wire route and outputs the data to, for example, a storage part 21 as such.
YAMASHITA NOBUO
SHOJI KIMIKATSU
OKI ELECTRIC IND CO LTD