To provide a method and a device for inspecting a semiconductor in which an inspection time can be shortened by operating a plurality of inspection device in parallel.

In the method for inspecting a semiconductor, inspection is started by inserting a wafer into a dimension inspecting device 2 requiring a longest inspection time, by inserting the wafer into an overlay inspecting device 1 requiring a second longest inspection time, and by inserting the wafer into a macro inspecting device 3 requiring a third longest inspection time. Subsequently, the inspected wafer is taken out of the macro inspecting device 3 and inserted into a wafer cassette, out of the overlay inspecting device 1 and inserted into the wafer cassette, and out of the dimension inspecting device 2 and inserted into the wafer cassette. Since the plurality of inspection devices are operated in parallel, the inspection time can be shortened.