To provide a method and a device for joining a solder ball, which improve efficiency in a joining treatment.
The method and the device for joining a solder ball are used for joining a plurality of electrode parts, which are formed on works to be joined, by melting solder balls. A plurality of suction nozzles profiling the electrode parts on the works to be joined suck the solder balls and transport them onto the electrode parts. Then, a laser beam irradiation part independently arranged on the upper face of the suction nozzles is moved along the arraying direction of the suction nozzles, and the solder balls are irradiated with a laser beam in a manner that the laser beam penetrates the sucking ports of the suction nozzles from the laser beam irradiation part through a suction nozzle transparent body, so that the solder balls are melted on the electrode parts.
MIZUNO TORU
YAMAGUCHI SATORU
Nobuaki Kato
Kazuo
Shinichi Usui
Takao Ochi
Teruhisa Motomiya
Seiichiro Takahashi
Koji Yoshizawa
Takao Matsui