METHOD AND DEVICE OF LASER BEAM MACHINING

Japanese Patent JP3715242

B2

PROBLEM TO BE SOLVED: To provide a method of laser beam machining by which a resign part is machined by eliminating the thermal influence of the machining of a metallic layer and the machining time is shortened at the same time, thus both the quality and the time efficiency are improved.
SOLUTION: A laser beam on a first optical path is divided into a second and a third optical paths and the laser beam which advances on the second optical path is made incident on a first part to be machined at which a metallic film is tightly stuck on the surface of a resin member, and a hole is formed on the metallic film of the first part to be machined. The first part to be machined is moved to a position at which a laser beam which advances on the third optical path is made incident, and a second part to be machined at which the metallic film is tightly stuck on the surface of the resign member is arranged at a position at which the laser beam which advances on the second optical path is made incident. A hole is formed on the resin member by making the laser beam which advances on the third optical path incident on a region in which the resin member is exposed on the first part to be machined, and at the same time a hole is formed on the metallic film of the second part to be machined by making the laser beam which advances on the second optical path incident on the second part to be machined.

Kazumasa Nojima
Keiji Iso

JP2002012829A

November 09, 2005

January 22, 2002

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Sumitomo Heavy Industries Ltd.

B23K26/064; B23K26/067; B23K26/382; H05K3/00; B23K101/16; B23K101/42; (IPC1-7): B23K26/38; B23K26/067; H05K3/00

JP11277273A
JP2001313471A
JP2002232150A
JP2000107875A

Keishiro Takahashi
Mikio Kuruyama

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