METHOD AND DEVICE FOR LASER BEAM MACHINING

Title:

METHOD AND DEVICE FOR LASER BEAM MACHINING

Document Type and Number:

Japanese Patent JP3820930

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a method and a device for a laser beam machining by which a machining performed by using plural laser beams having different wave lengths is performed with a device having a simpler construction and the adjustment of optical system and the optimization of machining condition are more simplified.
SOLUTION: The laser beam machining device is provided with laser oscillators 11 and 12 from which plural laser beams having different wave lengths are outputted, a common phase grating 14 which divides the laser beams having different wave lengths into respective plural laser beams, and a condensing lens 15 which condenses the laser beam. The arrangement of condensing spots of divided laser beams having respective wave lengths is decided according to the design of the phase grating.

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Inventors:

Atsushi Amako
Kazushige Umezu
Nakao Hitoshi

Application Number:

JP2001212666A

Publication Date:

September 13, 2006

Filing Date:

July 12, 2001

Export Citation:

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Assignee:

Seiko Epson Corporation

International Classes:

B23K26/067; B23K26/042; G02B5/18; B23K26/06; B23K26/064; B23K26/073; G02B27/10; H01S3/00; H01S5/40; (IPC1-7): B23K26/06; B23K26/04; G02B5/18

Domestic Patent References:

JP1245992A
JP5104276A
JP6106378A
JP11307940A

Foreign References:

WO1994029069A1

Attorney, Agent or Firm:

Souji Sasaki
Hisao Kobayashi
Saburo Kimura
Noboru Omura

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