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Title:
METHOD AND DEVICE FOR PREPARING AND SUPPLYING TREATMENT LIQUID
Document Type and Number:
Japanese Patent JP3869730
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a method and a device for preparing and supplying treatment liquid in which the deterioration of the treatment liquid and concentration fluctuation can be suppressed, particles can be reduced and economical efficiency can be improved as well when supplying the treatment liquid used for treating a semiconductor wafer or the like to a user's side.
SOLUTION: A treatment liquid preparing and supplying device 100 is provided with a dissolving preparation tub 102 supplied with raw material powder G and super deionized water J. The dissolving preparation tub 102 is connected through piping K1 to a treatment device 90 for substrates, and treatment liquid W prepared from the raw material powder G is supplied to the treatment device 90 in an on-site manner. At such a time, the super deionized water J is circulated approximately at all the time for suppressing the increase of microorganism concentration in the super deionized water J.


Inventors:
Nakagawa Toshimoto
Yuko Katagiri
Osamu Ogawa
Yasuyuki Kobayakawa
Kikukawa Makoto
Yutaka Saito
Yoshitaka Nishijima
Application Number:
JP2002007600A
Publication Date:
January 17, 2007
Filing Date:
January 16, 2002
Export Citation:
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Assignee:
Hirama Rika Laboratory Co., Ltd.
Nagase & Co., Ltd.
Nagase CMS Technology Co., Ltd.
International Classes:
G03F7/32; C09G1/02; H01L21/306; C23F1/08; C23F1/26; C25D21/00; C25D21/14; G03F7/42; H01L21/027; H01L21/304; (IPC1-7): H01L21/306; C23F1/26; C25D21/14; G03F7/32; G03F7/42; H01L21/027; H01L21/304
Domestic Patent References:
JP8283976A
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki