To recover copper from an aqueous solution produced through a production of a printed circuit board by using an electrolytic bath having an anode and a cathode which are separated with a copper ion transmission membrane, and removing copper from an aqueous mixture.

A system 10 is provided with a cathode 14 and an anode 16 which are separated with a copper ion transmission membrane 18, and the cathode 14 is formed of stainless steel or other metallic material such as copper and similarly the anode 16 is constituted of a metallic mesh such as a titanium mesh anode. During use of such system 10, copper cations in an anode solution 20 are moved to a cathode solution 22 through the copper ion transmission membrane 18 separating a cell 12, then copper is plated on the cathode 14, and then the copper is removed from the aqueous mixture. Thus, copper is recovered from the treated solution through a production of the printed circuit board without generating solid waste products.