Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD AND DEVICE FOR TRANSFERRING THIN PLATE MATERIAL
Document Type and Number:
Japanese Patent JP2002211707
Kind Code:
A
Abstract:

To provide a method and device for transferring thin plate materials, producing a reduction in size and cost of the device by allowing transfer of even extremely thin plate materials easily separated by the minimum number of vacuum pads.

Reciprocative vacuum pads 28a, 28b are used for sucking and lifting the uppermost thin plate 8 at its edge upper face on a stacker crane 1 side and towing it in the direction of a loading space 7 of the stacker crane 1. Thus, the uppermost thin plate material 8 out of the large size and extremely thin plate materials 8 can be easily sucked by the minimum number of vacuum pads 28a, 28b and transferred because the whole upper face of the thin plate material 8 is not so sucked by the vacuum pads 28a, 28b as conventional.


Inventors:
MATSUEDA EIJI
HAGIKURA SHINSUKE
Application Number:
JP2001002675A
Publication Date:
July 31, 2002
Filing Date:
January 10, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OKAMURA CORP
International Classes:
B65G1/04; B65G59/04; B65H3/08; B65H3/32; B66F9/07; (IPC1-7): B65G1/04; B65G59/04; B65H3/08; B65H3/32; B66F9/07
Domestic Patent References:
JPH0223117A1990-01-25
JPH10109709A1998-04-28
JPS586830A1983-01-14
JPH07172603A1995-07-11
JPH05200466A1993-08-10
Attorney, Agent or Firm:
Kazuo Shigenobu (1 person outside)