To realize a strong electrical joint which enables a large current to flow through it, dispensing with an after treatment by a method, wherein hard metal powder possessed of a large number of needle-like projections is used as conductive filler, an oxide film on the surface of an electrode terminal is broken with the needle-like projections of the powder, when the electrode terminal is jointed with pressure to a circuit on a wiring board 3 by the use of adhesive agent loaded with the conductive filter, and the projections are buried in the surface of the electrode terminal.

An electrode terminal 2 of an electronic element chip 1 is connected to the copper circuit 4 of a wiring board 3 with anisotropically conductive adhesive agent 6 where conductive filler is dispersed. Hard metal powder 5, possessed of a large number of needle-like projections, is used as the conductive filler. The conductive adhesive agent 6 is sandwiched in between the aluminum electrode terminal 2 and the copper circuit 4 provided to the wiring board 3, the electrode terminal 2 and the copper circuit 4 are stacked up interposing the adhesive agent 6 between them and thermocompressed to cure the adhesive agent 6. Therefore, an oxide film 7 formed on the surface of the aluminum terminal 2 is broken by the needle-like projections of the metal powder 6 with pressure, and the needle-like projections are buried both in the aluminum terminal 2 and in the copper circuit 4. Therefore, the aluminum terminal 2 and the copper circuit 4 are firmly and electrically jointed together with the buried projections.