Title:
基材上に金属を電着する方法
Document Type and Number:
Japanese Patent JP5674655
Kind Code:
B2
Abstract:
To electroplate a metal layer which has silica particles dispersed therein, a solution and a method for electrochemically depositing a metal on a substrate are provided, wherein the solution contains ions of the metal to be deposited and silica particles, wherein at least one silicon containing organic moiety is provided to said silica particles , said silicon containing organic moiety comprising at least one functional group selected from the group comprising amino, quaternized ammonium, quaternized phosphonium and quaternized arsonium which imparts the silica particles a positive electric charge while being in contact with the solution.
Inventors:
ミドデーケ ヘルマン・ヨーゼフ
Application Number:
JP2011517816A
Publication Date:
February 25, 2015
Filing Date:
July 10, 2009
Export Citation:
Assignee:
アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング
International Classes:
C25D3/12; C25D5/14; C25D15/02
Attorney, Agent or Firm:
Fujita アキラ
Hideki Imai
Mitsuhiro Kanazawa
Hideki Imai
Mitsuhiro Kanazawa