Title:
METHOD AND EQUIPMENT FOR INSPECTING SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP3851787
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To increase the reliability of inspection by automating the inspection of a transparent sealant of a semiconductor element, with the semiconductor element, which is such that a chip is mounted on a substrate, being also an object to be tested.
SOLUTION: The semiconductor element 1 to be inspected is located below a telecentric lens 5 and a CCD camera 6. When inspecting the surface of the sealant for defects, a light beam 3 from a light source 2 is incident into the semiconductor element 1 at an angle of 10 to 30° with respect to the upper surface of the chip, and imaging is conducted. When inspecting the inside of the sealant for defects, the light beam 3 is incident into the semiconductor element 1 at an angle of 0 to 20° with respect to the upper surface of the chip, and imaging is conducted. If there is no defect in the sealant, the light from the semiconductor element 1 is never incident into the lens 5, and if there are any defects in the sealant, scattered light generated by the defects is incident into the lens 5. Consequently, whether there is any defect in the sealant can be judged by looking at whether there is light in the lens 5.
Inventors:
Hirotaka Matsukawa
Kazuo Nishida
Kazuo Nishida
Application Number:
JP2001183564A
Publication Date:
November 29, 2006
Filing Date:
June 18, 2001
Export Citation:
Assignee:
Sharp Corporation
International Classes:
G01B11/30; H01L21/56; G01N21/956; H01L21/66; (IPC1-7): H01L21/56; G01B11/30; G01N21/956
Domestic Patent References:
| JP2000180136A | ||||
| JP10339705A | ||||
| JP11242001A |
Attorney, Agent or Firm:
Aoyama Aoi
Hiroshi Yamazaki
Hiroshi Yamazaki
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