Title:
METHOD FOR ERASING RESIST FILM PICTURE
Document Type and Number:
Japanese Patent JPH06232040
Kind Code:
A
Abstract:
PURPOSE: To provide a method by which an unnecessary ion-implanted resist film picture on a semiconductor substrate can be erased during the course of manufacturing a semiconductor integrated circuit device.
CONSTITUTION: When the method is used, a resist film picture on a substrate is removed by sticking an adhesive sheet, etc., to the upper surface of the picture and performing a heating process, to be concrete, by irradiating the picture with microwaves of 2.45 GHz in frequency so as to scatter the water contained in the sheet etc., and/or on the surface of the picture, and then, peeling the sheet, etc., from the semiconductor substrate together with the resist film picture.
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Inventors:
NAMIKAWA AKIRA
KIHARA YASUO
KIHARA YASUO
Application Number:
JP1362693A
Publication Date:
August 19, 1994
Filing Date:
January 29, 1993
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
G03F7/42; H01L21/027; H01L21/30; (IPC1-7): H01L21/027; G03F7/42
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