Title:
METHOD OF EVALUATING MOUNT POSITION PRECISION OF ELECTRONIC COMPONENT MOUNTING APPARATUS, TOOL AND DEDICATED SUBSTRATE FOR POSITION PRECISION EVALUATION
Document Type and Number:
Japanese Patent JP3960138
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for evaluating mount position precision of an electronic component mounting apparatus which has high precision and superior durability and can use a recognizing method by the same reflection illumination with an actual machine, and a tool and a dedicated substrate for position precision evaluation.
SOLUTION: For the mount position precision evaluation of the electronic component mounting apparatus which detects a position of mounting by a mount head shifting from a target mount position on control data, the tool 10 held as a dummy component for component recognition on a nozzle 3a is characterized in that a shape pattern 13 allowing light transmission only in a range corresponding to a lead of the electronic component is formed on the reverse surface of a transparent plate member 11 corresponding to the electronic component to be evaluated, white reflecting paper 12 which diffuses and reflects illumination light made incident from the reverse surface side is stuck on the top surface of the plate member 11 within the range of the shape pattern 13, and a scale pattern 14 for detecting a position shift from a mount position reference part is formed outside the shape pattern 13.
Inventors:
Keisuke Fujishiro
Akira Nakajima
Akira Nakajima
Application Number:
JP2002176852A
Publication Date:
August 15, 2007
Filing Date:
June 18, 2002
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K13/08; H05K13/04; (IPC1-7): H05K13/08
Domestic Patent References:
| JP2001136000A |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano