Title:
METHOD FOR FABRICATING SENSOR
Document Type and Number:
Japanese Patent JP2011137818
Kind Code:
A
Abstract:
To provide one or more sensors fabricated on a single chip that provide required performance characteristics, with improved manufacturing and operational reliability.
A method for fabricating a sensor is disclosed that in one embodiment bonds an etched semiconductor substrate wafer (130) to an etched device wafer (142), which includes a double silicon on insulator wafer to create a suspended structure, the flexure of which is sensed by an embedded piezoresistive sensor element (150). In one embodiment, the sensor measures acceleration. In other embodiments, the sensor measures pressure.
Inventors:
MANTRAVADI NARESH VENKATA
GAMAGE SISIRA KANKANAM
GAMAGE SISIRA KANKANAM
Application Number:
JP2010289963A
Publication Date:
July 14, 2011
Filing Date:
December 27, 2010
Export Citation:
Assignee:
GEN ELECTRIC
International Classes:
G01P15/12; B81C3/00; G01D21/02; G01L9/00; H01L29/84
Domestic Patent References:
| JP2003344444A | 2003-12-03 |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Hirokazu Ogura
Toshihisa Kurokawa