Title:
METHOD FOR FEEDING POWER TO ELECTROPLATING DEVICE
Document Type and Number:
Japanese Patent JPH04289199
Kind Code:
A
Abstract:
PURPOSE:To feed a current with large capacity to the electroplating device without damaging a material to be plated or exerting an adverse effect of oxides, etc., on it when a long-sized wide thin material is electroplated. CONSTITUTION:A long-sized wide thin material 2 to be plated is brought into surface contact with a conductor roller 5 for supplying power to the material 2, and the contact part is dipped in an electrolyte 7. The electrolyte 7 is constantly circulated to suppress the temp. rise of the contact part, hence the contact resistance between the material 2 and the roller 5 is reduced, and a large current can be applied.
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Inventors:
OKADA SHINJI
Application Number:
JP7561291A
Publication Date:
October 14, 1992
Filing Date:
March 15, 1991
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
C25D7/00; C25D7/06; C25D17/00; C25D21/00; (IPC1-7): C25D7/00; C25D7/06; C25D17/00; C25D21/00
Attorney, Agent or Firm:
Yoshihisa Oshida