Title:
METHOD OF FORMING CONDUCTOR PATTERN, WIRING MEMBER MANUFACTURED THEREBY, CONNECTOR, FLEXIBLE PRINTED WIRING BOARD, AND ANISOTROPIC CONDUCTIVE MEMBER
Document Type and Number:
Japanese Patent JP3694825
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method by which a conductor pattern can be formed easily on a pressure-sensitive adhesive or adhesive, and the pressure-sensitive adhesive or adhesive is made to be usable for various uses as a mechanical coupling means.
SOLUTION: In this method, the conductor pattern 18 is formed in such a way that a metallic thin film 15 is formed on a die 11 having protrusions 12 formed correspondingly to a conductor pattern to be formed. The thin film 15 formed on the protrusions 12 is transferred to the pressure-sensitive adhesive (adhesive) 16 applied to one surface of a substrate 17, by closely adhering the surface of the substrate 17 carrying the adhesive 16 to the thin film 15 formed on the protrusions 12 and pulling up the substrate 17.
Inventors:
Shino Oguchi
Tomishige Tai
Tomishige Tai
Application Number:
JP2000243950A
Publication Date:
September 14, 2005
Filing Date:
August 11, 2000
Export Citation:
Assignee:
Japan Aviation Electronics Industry Co., Ltd.
International Classes:
H01R11/01; H01B5/14; H01B5/16; H01B13/00; H01R43/00; H05K1/14; H05K3/20; H05K3/40; (IPC1-7): H05K3/20; H01R11/01; H01R12/06; H01R12/08; H01R43/00; H05K1/14
Domestic Patent References:
| JP58012586B1 | ||||
| JP62015777A | ||||
| JP10319222A | ||||
| JP6202309A | ||||
| JP5075248A | ||||
| JP5275834A | ||||
| JP61240511A | ||||
| JP236071U | ||||
| JP9312470A | ||||
| JP4311085A |
Attorney, Agent or Firm:
Taku Kusano
Minoru Inagaki
Minoru Inagaki
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