Title:
脆性材料基板のクラック形成方法
Document Type and Number:
Japanese Patent JP5055383
Kind Code:
B2
Inventors:
Su Ukou
Seiji Shimizu
Koji Yamamoto
Kenji Fukuhara
Seiji Shimizu
Koji Yamamoto
Kenji Fukuhara
Application Number:
JP2009547976A
Publication Date:
October 24, 2012
Filing Date:
December 11, 2008
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00; B23K26/364; B23K26/40; C03B33/04; C03B33/09
Domestic Patent References:
| JP2002087836A | 2002-03-27 | |||
| JP2002346995A | 2002-12-04 |
Attorney, Agent or Firm:
Yoshio Kashima