Title:
METHOD FOR FORMING ELECTRONIC COMPONENT AND OPTICAL COMPONENT BY USING LASER ABLASION
Document Type and Number:
Japanese Patent JP2005181958
Kind Code:
A
Abstract:
To provide an improved method for forming an electronic component and/or an optical component by using laser ablasion.
This method involves: (a) providing an electronic substrate having a polymeric layer, wherein the polymeric layer includes a polymer with units of the formula (R1SiO1.5), wherein R1 is a substituted or unsubstituted organic group; and (b) removing selected portions of this polymeric layer by laser ablasion. The invention has particular applicability in the electronics and optoelectronics industries.
Inventors:
MOYNIHAN MATTHEW L
COLANGELO CARL J
SHELNUT JAMES G
SICARD BRUNO M
PUGLIANO NICOLA
COLANGELO CARL J
SHELNUT JAMES G
SICARD BRUNO M
PUGLIANO NICOLA
Application Number:
JP2004096538A
Publication Date:
July 07, 2005
Filing Date:
March 29, 2004
Export Citation:
Assignee:
ROHM & HAAS ELECT MAT
International Classes:
G02B6/12; B23K26/00; B23K26/40; G02B6/122; G02B6/13; G02B6/132; G02B6/136; G02B6/42; G02B6/43; H05K1/02; H05K3/00; G02B6/02; G02B6/36; (IPC1-7): G02B6/12; G02B6/122; H05K1/02
Attorney, Agent or Firm:
Minoru Senda
Koji Hashimoto
Koji Hashimoto
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