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Patent Searching and Data


Title:
METHOD FOR FORMING FILM PATTERN OF BEAM SHAPE
Document Type and Number:
Japanese Patent JP2002139827
Kind Code:
A
Abstract:

To provide a correcting method by which a deposition layer where both an opening end part and a top end part are formed generates no thickness difference, top realize correction of white deface by which a local part does not become very fat and further to provide a correcting method by which a long beam-shaped body can be formed in correction of white defect in a silicon stencil by deposition using focusing ion beams.

When the beam-shaped body is formed at the opening end part of a sample by deposition using a focusing ion beams device, a method for forming a film pattern of a beam shape in which deposition is executed by narrowly limiting an irradiation region of the ion beam to a strip shape from the opening end part, the beam-shaped body is formed by growing the thin deposition layer by successively shifting the irradiation region on a top end direction and then the deposition layer having desired thickness is formed on the thin deposition layer, is adopted.


Inventors:
MINAFUJI TAKASHI
Application Number:
JP2000333368A
Publication Date:
May 17, 2002
Filing Date:
October 31, 2000
Export Citation:
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Assignee:
SEIKO INSTR INC
International Classes:
B81C1/00; C23C16/00; C23C16/04; C23C16/26; C23C16/44; G03F1/20; G03F1/72; G03F1/74; G03F7/20; H01L21/027; (IPC1-7): G03F1/16; G03F7/20; H01L21/027
Attorney, Agent or Firm:
Masaaki Sakagami