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Title:
METHOD FOR FORMING FINE PATTERN AND RESIST COMPOSITION USED THEREFOR
Document Type and Number:
Japanese Patent JP2006085081
Kind Code:
A
Abstract:

To provide a resist composition giving excellent solubility to a resist coating on exposure to light particularly at 193 nm wavelength, and to provide a method for forming a fine pattern with excellent contrast by using the resist composition.

The resist composition comprises (a) an acid dissociable functional group-containing polymer, (b) a photo-acid generating agent and (c) a dissolution inhibitor. The dissolution inhibitor (c) consists of a polymer necessarily containing a structural unit derived from at least one kind of monomer (m1) selected from fluorine-containing norbornene derivatives having a moiety expressed by formula (1). In the formula (1), Rf1 and Rf2 may be same or different and each represents a 1-10C fluorine-containing alkyl group which may have an ether bond; X represents F or CF3; and Y1 represents an OH group or an acid dissociable functional group which is dissociated by an acid to change into an OH group. In the method for forming a fine pattern, a fine pattern is formed by using the resist composition.


Inventors:
ARAKI TAKAYUKI
ISHIKAWA TAKUJI
YOSHIDA TOMOHIRO
Application Number:
JP2004272451A
Publication Date:
March 30, 2006
Filing Date:
September 17, 2004
Export Citation:
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Assignee:
DAIKIN IND LTD
International Classes:
G03F7/039; C08F32/08; G03F7/004; H01L21/027
Domestic Patent References:
JP2004182796A2004-07-02
JP2001350265A2001-12-21
JPH11338153A1999-12-10
JP2005221960A2005-08-18
Foreign References:
WO2004035641A12004-04-29
WO2004024787A12004-03-25
WO2003006413A12003-01-23
WO2003007080A12003-01-23
Attorney, Agent or Firm:
Sota Asahina
Fumio Akiyama