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Patent Searching and Data


Title:
METHOD OF FORMING MULTICOMPONENT DEVICE LAYER ON WAFER SURFACE
Document Type and Number:
Japanese Patent JPH10189563
Kind Code:
A
Abstract:

To achieve the substantially even distribution of a material through wafers by a method wherein the first segment is provided with the wider angle region than that of the second segment at the sufficient ratio for effectively narrowing the diffusion path of the first component for narrowing the diffusion path of the same.

A reactor is composed of wafer cassette storage bays 130, 135, load locking units 140, 145, a transport chamber 150 and a reaction chamber 160. Besides, another reaction chamber 320 is divided into a plurality of sectors in equal areas while transport injectors 340 are arranged in the sectors around the reactor. The purpose of the injectors 340 is to make a proper chemical material run into the reaction chamber 320. These injectors 340 are arranged so that the chemical material may run from the injectors 340 to the center of a susceptor in a linear path that is to the center of the reaction chamber 320. In such a constitution, the susceptor is turned to make it possible to bring the chemical material into contact with the surface regions of wafers.


Inventors:
MATHIAS IRG
MARKUS KIRUHIYOFU
CHRISTOPH WERNER
Application Number:
JP34963597A
Publication Date:
July 21, 1998
Filing Date:
December 18, 1997
Export Citation:
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Assignee:
SIEMENS AG
International Classes:
H01L21/683; C23C16/44; C23C16/455; C30B25/14; H01L21/205; H01L21/31; H01L21/316; (IPC1-7): H01L21/31; H01L21/205; H01L21/68
Attorney, Agent or Firm:
Toshio Yano (1 outside)