METHOD OF FORMING PLANE OF MUTUAL CONNECTING BASE MATERIAL BY DIAMOND TURNING

Title:

METHOD OF FORMING PLANE OF MUTUAL CONNECTING BASE MATERIAL BY DIAMOND TURNING

Document Type and Number:

Japanese Patent JPH03239354

Kind Code:

A

Abstract:

PURPOSE: To achieve homogenity of the thickness of an electronic mutually-connecting base material by performing diamond machining of a body, forming a flat surface, constituting a metal-polymer composite material for incorporating a minute electronic- circuit component on the surface, performing the diamond machining and forming the flat surface of the body. CONSTITUTION: When a chuck 14, wherein the flat surface is formed by diamond machining, is located at the first position, a flexible support 24 is made to advance to one side of the cutting path of a diamond tool 10 until a metal-polymer composite material 22 comes to the center of the surface. Then, the support 24 under the composite material 22 is sucked and secured to the diamond-machining surface of the vacuum chuck 14. After the surface of the composite material 22 has undergone diamond machining with the vacuum chuck 14, being advanced to the side of the diamond tool 10, the vacuum is broken and the support 24 is opened. The vacuum chuck 14 is returned to the original position. This procedure is repeated until all the composite materials 22 undergo diamond machining and wound around a winding roll, together with the support 24. Thus, the homogenity in the thickness of the electronic mutually connecting base material is achieved.

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Inventors:

RICHIYAADO JIEIMUSU UETSUBU
TEIMOSHII RII HOOPUMAN

Application Number:

JP29734690A

Publication Date:

October 24, 1991

Filing Date:

November 05, 1990

Export Citation:

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Assignee:

MINNESOTA MINING & MFG

International Classes:

H05K3/46; B24B7/06; B24B7/22; H01L21/48; H01L23/538; H05K3/26; (IPC1-7): H01L23/522; H05K3/46

Attorney, Agent or Firm:

Aoki Akira (4 outside)

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