Title:
剥離の起点の形成方法
Document Type and Number:
Japanese Patent JP6661811
Kind Code:
B2
Abstract:
A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.
Inventors:
Ritsu Komatsu
Kohei Yokoyama
Masakatsu Ohno
Satoru Idojiri
Toshio Ikeda
Jimbo Yasuhiro
Hiroki Adachi
Yoshiharu Hiragata
Shingo Eguchi
Nakamura Taiki
Kohei Yokoyama
Masakatsu Ohno
Satoru Idojiri
Toshio Ikeda
Jimbo Yasuhiro
Hiroki Adachi
Yoshiharu Hiragata
Shingo Eguchi
Nakamura Taiki
Application Number:
JP2019041476A
Publication Date:
March 11, 2020
Filing Date:
March 07, 2019
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
B26D3/06; B26D3/08; B26D7/27; H01L51/50; H05B33/02; H05B33/10; H05B33/14
Domestic Patent References:
| JP2008272845A | ||||
| JP2012186158A | ||||
| JP2009141070A | ||||
| JP2012083733A | ||||
| JP200996310A | ||||
| JP2007260865A | ||||
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