Title:
METHOD FOR FORMING THICK FILM PATTERN
Document Type and Number:
Japanese Patent JP3338402
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the productivity and raise the production yield.
SOLUTION: An intaglio plate 1, which is a female form of an aiming pattern is made of a curable resin, the recessed parts of the intaglio plate 1 are filled with a pattern forming material 2, a substrate 3 is closely attached to the intaglio plate 1 as to sandwich the pattern forming material 2 between them and the pattern forming material 2 is cured, and after that, the intaglio plate 1 is so separated from the substrate 3 as to leave the cured pattern forming material 2 on the surface of the substrate 3. Next, the resultant substrate to the surface of which the pattern forming material 2 is transferred is burned. Since a pattern with a 100 μm or higher height is obtained by one time operation, the time taken for the treatment can be shortened as compared with a layering method by a conventional screen printing and positioning work is required only one time to result in simplification of the process. Moreover, since a curable resin is used for forming the female form of the aiming pattern, the female form is easily formed to shorten the preparatory process.
Inventors:
Takeshi Matsumoto
Application Number:
JP17651899A
Publication Date:
October 28, 2002
Filing Date:
March 02, 1990
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B05D1/28; B05D3/02; B05D5/06; B05D7/24; (IPC1-7): B05D1/28; B05D3/02; B05D5/06; B05D7/24
Domestic Patent References:
| JP5787318A | ||||
| JP56121666A | ||||
| JP5434211A | ||||
| JP1319945A | ||||
| JP1176514A |
Attorney, Agent or Firm:
Ikuro Doi