Title:
厚膜配線の形成方法及び積層型電子部品の製造方法
Document Type and Number:
Japanese Patent JP4111116
Kind Code:
B2
Abstract:
In a method of forming a thick-film wiring on a substrate, photosensitive-electroconductive paste is filled into a pattern groove formed on the surface of a light-transmitting intaglio plate. The pattern groove corresponds to a desired thick-film wiring pattern. The photosensitive-electroconductive paste filled in the pattern groove are irradiated with light-rays from the front and back sides of the intaglio plate to cause the paste to harden until the overall peripheral surface of the electroconductive paste has a predetermined hardness. The electroconductive paste hardened in the pattern grooves of the intaglio plate is transferred to an intermediate piece. Then, the electroconductive paste is transferred from the intermediate piece to a substrate. Thereafter, the electroconductive paste is fired, whereby a thick-film wiring is formed on the substrate.
Inventors:
Tetsuya Oda
Fujii Choichiro
Nishikawa Etsuo
Fujii Choichiro
Nishikawa Etsuo
Application Number:
JP2003353100A
Publication Date:
July 02, 2008
Filing Date:
October 14, 2003
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B41F9/01; H05K3/12; H01L21/48; H05K3/20; H05K1/09
Domestic Patent References:
| JP11135916A | ||||
| JP11154782A | ||||
| JP6226584A | ||||
| JP2003283105A | ||||
| JP62216290A |
Attorney, Agent or Firm:
Hidetaka Tsutsui