Title:
METHOD OF GRINDING CUTTING TOOL FOR SEPARATING DISK FROM ROD-SHAPED OR BLOCK-SHAPED WORK AND SEPARATION METHOD
Document Type and Number:
Japanese Patent JPS63306864
Kind Code:
A
Abstract:
Cutting-off tools whose cutting edge has a cutting layer with a bonded cutting grain are sharpened by sawing momentarily into a solid sharpening substance, in which case, in addition to a relative movement between cutting edge and solid material corresponding to the sawing operation, an oscillating relative movement transversely thereto is also performed. The process is used with particular advantage in combination with processes for the centerhole sawing of semiconductor or oxidic material.
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Inventors:
GERUHARUTO BUREEMU
YOHAN NIIDERUMAIERU
YOHAN NIIDERUMAIERU
Application Number:
JP10439788A
Publication Date:
December 14, 1988
Filing Date:
April 28, 1988
Export Citation:
Assignee:
WACKER CHEMITRONIC
International Classes:
B24B3/36; B23D63/14; B24B53/00; B28D1/02; B28D5/02; (IPC1-7): B24B3/36
Foreign References:
| DE2359096A1 | 1975-06-05 |
Attorney, Agent or Firm:
Kiyotaka Sasaki (3 outside)
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