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Title:
METHOD OF HEAT-WELDING PLASTIC MOLDED PRODUCT AND METHOD OF HEAT WELDING CHENILLE
Document Type and Number:
Japanese Patent JP3285599
Kind Code:
B2
Abstract:

PURPOSE: To exclude cleaning of a hot plate and enable prevention of not only shrinkage of a thin lip part but also peeling of a metallic film of a chenille, by a method wherein both joining surfaces of plastic materials are allowed to perform non-contact heating so that a temperature becomes at least the molding temperature of a thermoplastic resin material and not exceeding the carbonization temperature.
CONSTITUTION: In a heating process, both end surfaces of a chenille 10 are allowed to perform non-contact heating so that a temperature becomes at least the molding temperature of a thermoplastic resin material and not exceeding the carbonization temperature. Both end surfaces of the chenille 10 are approached, a heater 80 is positioned within a space between both end surfaces of the chenille 10 and the both end surfaces of the chenille 10 are allowed to perform non-contact heating by radiant heat of the heater 80 until a melting allowance 17 becomes a molten state. The heater 80 is constituted of a pair of static induction heaters 81, 81, a temperature sensor 82 positioned within a space between both the heaters 81, 81 and a hot plate 83 surrounding both heaters 81, 81 and temperature sensor 82.


Inventors:
Keisho Sugiyama
Koji Watanabe
Sugita removed
Hiroyuki Maruoka
Application Number:
JP27400691A
Publication Date:
May 27, 2002
Filing Date:
October 22, 1991
Export Citation:
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Assignee:
Shoei Gosei Co., Ltd.
Nifco Co., Ltd.
International Classes:
B29C65/18; B29C65/78; B29C69/00; B29C47/02; B29L9/00; B29L31/58; (IPC1-7): B29C65/18; B29C47/02; B29C65/78; B29C69/00
Domestic Patent References:
JP3274006A
Attorney, Agent or Firm:
Hiromichi Kuroda (2 outside)