Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR IMPROVING CONDUCTIVITY OF AND METHOD FOR ELECTROSTATIC COATING OF RESIN MOLDING
Document Type and Number:
Japanese Patent JPH08333459
Kind Code:
A
Abstract:

PURPOSE: To obtain a method for improving the conductivity of a resin molding to thereby give it characteristics suitable for electrostatic coating by mixing a specific nitrogen compd. into the resin material for the molding, molding the resin material, and subjecting the surface of the resulting molding to a corona discharge treatment.

CONSTITUTION: A material for a resin molding is mixed with a nitrogen compd. represented by the formula: R1-Y [wherein R1 is a 5-21C alkyl or alkenyl; and Y is a group represented by formula I or II (wherein R2 is H or a group represented by formula III; R3 is a group of formula IV or V; R4 is H a 1-4C alkyl; R5 is CH3 or CH2CH2)H; and n is 0-20)] and molded. Then, the surface of the resulting molding is subjected to a corona discharge treatment. The nitrogen compd., examples being an aliph. alkanolamide compd. and an amine oxide compd., is used usually in an amt. of 0.01-10wt.% of the material. Thus obtd. molding can be electrostatically coated by spraying and depositing a statically charged coating material.


Inventors:
SHIRAIWA TETSUO
Application Number:
JP13904595A
Publication Date:
December 17, 1996
Filing Date:
June 06, 1995
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAI ICHI KOGYO SEIYAKU CO LTD
International Classes:
B05D1/04; B05D3/06; B05D7/02; C08J5/10; C08J7/00; C08K5/17; C08L71/00; C08L71/02; (IPC1-7): C08J5/10; B05D1/04; B05D3/06; B05D7/02; C08J7/00; C08K5/17; C08L71/02
Attorney, Agent or Firm:
Hitoko Tsuda (2 outside)