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Title:
METHOD FOR INSERT MOLDING AND INSERT-MOLDED PART
Document Type and Number:
Japanese Patent JP3877837
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To improve bonding between an insert and resin of an insert-molded part even when crystalline thermoplastic resin (specially, liquid crystalline polymer) is used.
SOLUTION: In a method for insert-molding thermoplastic resin, insert molding is performed by reducing thickness of resin base 1 near a metal bar (an insert) 2 for forming a thin part 3. In this method, it is effective to reduce thickness of the resin base near the insert (the thin part) by 20% or more. The thermoplastic resin includes crystalline thermoplastic resin, for example, liquid crystalline polymer, etc.


Inventors:
Hiromi Otsuka
Takeshi Sasaki
Application Number:
JP17048297A
Publication Date:
February 07, 2007
Filing Date:
June 26, 1997
Export Citation:
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Assignee:
Polyplastics Co., Ltd.
International Classes:
B29C33/12; B29C45/14; B29C33/42; B29C45/26; C08L67/03; B29K67/00; B29K101/12; B29L9/00; (IPC1-7): B29C33/12; B29C33/42; B29C45/14; B29C45/26; //C08L67/03; B29K101:12; B29L9:00
Domestic Patent References:
JP1310924A
JP4062017A
JP7269680A
JP4173216A
JP8072099A
JP62134232A
JP3092475U
JP2148468U
JP5090031U
Attorney, Agent or Firm:
Mitsuo Kata