To provide a method of inspecting the shape of a bonding ball which contributes to power saving in the assembling process of an apparatus by automatically inspecting a bonding situation with reflected light from a bonding part irradiated with light so as to automate an inspection process.

The bonding ball 18 bonded to the bonding surface of the electrode, etc., of a semiconductor laser chip 10 and a bonding wire 12 are irradiated with light to find the point reflected light 20 of the bonding ball 18 and the linear reflected light 21 of the bonding wire 12. Thereafter, the inspecting point G of the linear reflected light 21 is set at a position at a prescribed distance from the bonding surface, and thereafter a dislocation X1 in the horizontal direction of the inspecting point G with respect to the point reflected light 20 is measured and compared with a previously set reference quantity X0 for deciding propriety.