Title:
METHOD AND INSTRUMENT FOR MEASURING FILM THICKNESS
Document Type and Number:
Japanese Patent JP3681319
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To accurately measure a film thickness of an objective thin film having a line width narrower than a measuring range by removing a component of a nonobjective thin film from spectroscopic reflected spectra within a measuring range including the objective thin film.
SOLUTION: A step S1 for measuring the spectroscopic reflected spectra reflected within the measuring range including the objective thin film of a film thickness measuring object and the nonobjective thin film not applied to film thickness measurement, a step S4 for extracting only the component of the objective thin film from the spectroscopic reflected spectra as an extracted spectroscopic reflected spectrum, and a step S5 for calculating the film thickness of the objective thin film based on the extracted spectroscopic reflected spectrum are executed in this film thickness measuring method of the present invention. Only the film thickness of the objective thin film having the line width narrower than the measuring range is found by calculating the film thickness of only the objective thin film, based on the extracted spectroscopic reflected spectrum in which the component of the nonobjective thin film is removed.
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Inventors:
Shigeaki Fujiwara
Atsushi Tamada
Atsushi Tamada
Application Number:
JP2000097087A
Publication Date:
August 10, 2005
Filing Date:
March 31, 2000
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
G01B11/06; H01L21/66; (IPC1-7): G01B11/06
Domestic Patent References:
| JP4025708A | ||||
| JP11094525A |
Attorney, Agent or Firm:
Tsutomu Sugiya
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