To improve insulating properties at cutting parts of wiring lines, and to prevent adhesion of moisture to the cutting faces or occurrence of corrosion thereon.
Wiring lines 102 composed of a copper foil and connected with connection branched parts 104 each other are formed on the surface of an insulating substrate 101, and a solder resist 103 for protecting the wiring line 102 is laminated to form a printed wiring board 100. Through-holes 105 penetrating the printed wiring board 100 are arranged by punching parts including some of the connection branched parts 104 to cut unneeded wiring lines 102, thereby obtaining a required wiring pattern. Cutting parts and cutting faces of the wiring lines 102 exposed to the through-holes 105 are protected with a sealing material 106 by sealing the through-holes 105, with the sealing material 106 composed of an insulative synthetic resin to improve insulating properties at the cutting parts of the wiring lines 102, and to prevent adhesion of moisture to the cutting faces or occurrence of corrosion thereon.
NISHIKAWA NAOYUKI
OKA SHOICHI
SAKAMOTO KOJI
TAKAMI SHIGENARI
KANI MITSUHIRO
SAKAI TAKAMASA
| JPH04142097A | 1992-05-15 | |||
| JPH1167799A | 1999-03-09 | |||
| JP2002057442A | 2002-02-22 | |||
| JPH06112633A | 1994-04-22 | |||
| JPH09130024A | 1997-05-16 | |||
| JPH08227908A | 1996-09-03 | |||
| JPS62108554A | 1987-05-19 |
Atsuo Mori
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