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Patent Searching and Data


Title:
METHOD FOR JOINING FINE WIRE TO PLATE
Document Type and Number:
Japanese Patent JPH03230882
Kind Code:
A
Abstract:

PURPOSE: To obtain firm joining strength between the fine wire and plate and to prevent cutting of the fine wire and the generation of spatters by fixing the fine wire on the bottom of the plate having the melting point lower than the fine wire and projecting a laser beam, an electron beam, etc., larger than the diameter of the fine wire from the upper part of the plate to perform joining.

CONSTITUTION: Since the laser beam 2 irradiates from the plate 5 side, the plate 5 is first molten. Meanwhile, since the fine wire 4 has the melting point higher than the plate 5, even if the plate 5 is molten, the fine wire 4 is not molten. When the plate 5 is in a molten state, the fine wire 4 is drawn into the molten plate 5 by the surface tension thereof. When the irradiation of the laser beam, the electron beam, etc., is completed and a molten part of the plate 5 resolidifies, the plate 5 and the fine wire 4 are joined together by its compressive stress in the end. Consequently, the firm and stable joining strength can be obtained.


Inventors:
FUNEMI KOJI
SHIMA HIROZO
OSADA KEIJI
Application Number:
JP2751290A
Publication Date:
October 14, 1991
Filing Date:
February 07, 1990
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23K15/00; B23K26/21; (IPC1-7): B23K15/00; B23K26/00
Attorney, Agent or Firm:
Tomoyuki Takimoto (1 person outside)