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Title:
METHOD FOR JOINING OXIDE DISPERSION ALLOY AND JOINING MEMBER
Document Type and Number:
Japanese Patent JPH1128580
Kind Code:
A
Abstract:

To execute joining between the metal lattices of a base material with each other in a solid solution state without destroying the bumboo structure of an alloy base material by cleaning the surface of oxide dispersion alloy, and then forming protection film, heating in a vacuum chamber and joining.

An Ag film 104 is formed on the cleaned surface 105 of an oxide dispersion alloy MA 754:101 cleaned by spattering. After the spattering, Ag coated MA 754:101 is taken out of a vacuum chamber, and set in a heating and joining furnace, heated in the air and subjected to preliminary joining. Then, a sample with the preliminary joining surface 106 is, after set in a vacuum heating joining furnace, heated by a heater 110 in a vacuum chamber, and thus joining is completed. the pressing force is in the range of 0.5-10 kg/mm2. Because the melting point of Ag film 104 is 1080°C, the most part of the Ag film 104 is melted and discharged to the outside of the sample by the pressing, and the remaining part is diffused into the MA 754 base material 107 and 108.


Inventors:
ONUKI HITOSHI
NIHEI MASAYASU
FUNAMOTO TAKAO
KATO MITSUO
Application Number:
JP18206497A
Publication Date:
February 02, 1999
Filing Date:
July 08, 1997
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
F01D5/12; B23K20/00; B23K20/14; B23K20/16; C22C21/00; C22F1/00; C22F1/10; F01D9/02; B23K103/16; (IPC1-7): B23K20/00; B23K20/14; B23K20/16; C22C21/00; C22F1/00; C22F1/10; F01D5/12; F01D9/02
Domestic Patent References:
JPS62165985A1987-07-22
JPS6280363U1987-05-22
Attorney, Agent or Firm:
Ogawa Katsuo



 
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