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Patent Searching and Data


Title:
METHOD OF JOINTING A PLURALITY OF SURFACES INTEGRALLY AND ASSEMBLY AND ARTICLE PRODUCED THEREFROM
Document Type and Number:
Japanese Patent JPH11343466
Kind Code:
A
Abstract:

To provide a method for substantially removing voids, when two surfaces, particularly flat surfaces are integrally jointed and obtain assemblies and articles produced through the method.

A single point adhesive contact 3 attachment is given on the surface 1 and the adhesive 4 is radially extended from the attachment at the center in a spoke wheel and covering substantially all over the surface with diagonally crossing adhesive bands whereby the surfaces are integrally jointed through the adhesive. The surface 2 is pressed integrally as the adhesive is intervened between the surfaces so that the adhesive extends and cover the surface all over whereby the surfaces 2 are jointed integrally.


Inventors:
GAYNES MICHAEL A (US)
KODNANI RAMESH R (US)
Application Number:
JP9896799A
Publication Date:
December 14, 1999
Filing Date:
April 06, 1999
Export Citation:
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Assignee:
IBM (US)
International Classes:
C09J5/00; F16B11/00; (IPC1-7): C09J5/00
Attorney, Agent or Firm:
Hiroshi Sakaguchi (1 person outside)