Title:
METHOD OF LAMINATING MOLDED PRODUCT AND ITS UTILIZATION
Document Type and Number:
Japanese Patent JP2003289180
Kind Code:
A
Abstract:
To provide a method by which an electrical insulation layer having excellent wiring embeddability and surface flatness can be formed.
In this method, a film- or sheet-like resin molded product is laminated upon an internal substrate having a conductor circuit on its surface by heating and pressurizing the molded product through a heat-resistant rubber sheet by using a pressing plate. The rubber sheet has a thickness which is thicker than that of the conductor circuit within the range of ≤20 times of the thickness of the conductor circuit.
More Like This:
Inventors:
TSUKAMOTO ATSUSHI
Application Number:
JP2002090157A
Publication Date:
October 10, 2003
Filing Date:
March 28, 2002
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
B32B15/08; B29C65/02; H05K3/46; B29L9/00; (IPC1-7): H05K3/46; B29C65/02; B32B15/08
Previous Patent: PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
Next Patent: METHOD OF MANUFACTURING SUBSTRATE FOR MULTILAYERED PRINTED WIRING BOARD
Next Patent: METHOD OF MANUFACTURING SUBSTRATE FOR MULTILAYERED PRINTED WIRING BOARD