Title:
METHOD FOR LASER MARKING RESIN MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP3747657
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent drop out or damage of a mark caused by releasing and to reduce waste of a material.
SOLUTION: A mold 7 having a frontward and rearward movable core die 6 in a cavity 5 is used, a resin 8 is supplied to the cavity 5, and then a resin molded product 1 is molded, and a recess 2 is formed on a part of a surface of the molded product 1 by the die 6 advanced into the cavity 5. Then, a colored resin 9 is supplied to the recess 2 of the molded product 1 in the mold 7 to form a molding layer 7 in the recess 2. Thereafter, a laser beam is emitted to the layer 3 to mark it. The layer 3 can be formed in the recess 2 molded by the die 6. The layer 3 is also brought into close contact with an inside surface or the recess 2 in addition to a bottom of the recess 2 to be scarcely released. Particularly, an end face of the layer 3 is located in the recess 2 and not exposed to prevent it from being released from the exposed end of the end face of the layer 3.
Inventors:
Naoto Ikegawa
Keiji Higashi
Sakuo Kamada
Yuichi Uchida
Keiji Higashi
Sakuo Kamada
Yuichi Uchida
Application Number:
JP30611898A
Publication Date:
February 22, 2006
Filing Date:
October 27, 1998
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B29C45/16; B23K26/00; B29C45/56; B29C59/16; (IPC1-7): B29C59/16; B23K26/00; B29C45/56
Domestic Patent References:
| JP10138293A | ||||
| JP6044856A | ||||
| JP62074615A |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori