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Patent Searching and Data


Title:
METHOD OF LAYING FLOOR HEATING HEAT DISSIPATION PLATE
Document Type and Number:
Japanese Patent JPH10253083
Kind Code:
A
Abstract:

To provide a method of laying a floor heating heat sink at a predetermined position on a floor surface of a general dwelling, an assembly dwelling, a commercial building, or a hotel, and a method of laying the floor heating heat sink while inspecting the presence of any damage of a heat medium tube upon fixing the floor heating heat sink disposed at a predetermined position on a floor surface.

A heat medium tube 3 including a conductive layer 4 is disposed in a groove 2 formed meandering in a heat insulating member layer 1, and a surface of the heat insulating member layer 1 is coated with a surface coated layer 6 including a conductive thin plate, and further there is formed a current detection circuit, to which a current detection device 8 is connected, between the conductive layer 4 of the heat medium tube 3 and the conductive thin plate of the surface coated layer 6, and furthermore a floor heating heat sink is fixed at a predetermined position with a nail, detecting a conduction state of the circuit with the current detection device 8.


Inventors:
SASAKI TAKASHI
INOUE NORIAKI
IIJIMA SHIGEKO
Application Number:
JP25974597A
Publication Date:
September 25, 1998
Filing Date:
September 25, 1997
Export Citation:
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Assignee:
MITSUBISHI KAGAKU SANSHI CORP
International Classes:
F24D3/16; (IPC1-7): F24D3/16
Attorney, Agent or Firm:
Shigemitsu Sasaki