Title:
METHOD FOR LOADING MICRO GRANULAR OBJECT
Document Type and Number:
Japanese Patent JP3223607
Kind Code:
B2
Abstract:
PURPOSE: To provide a method for loading micro-granular object, e.g. a solder ball, positively by completely eliminating mechanical sliding part into which the micro-granular object intrudes.
CONSTITUTION: Solder balls 2 are blown up through suction of a a straight track 4 and the air is discharged through a net 5 to the outside whereas the solder balls 2 are struck against the net 5 to be fallen into a determination cup 6. Solder balls 2 are then transferred from the determination cup 6 into a closed space 10 of a swing head 8 using compressed air and then loaded to a glass jig 11. This method allows loading of micro-granular object to a glass jig.
Inventors:
Katsuhisa Tanaka
Hitoshi Odashima
Fukasawa Hideyuki
Hitoshi Odashima
Fukasawa Hideyuki
Application Number:
JP31165992A
Publication Date:
October 29, 2001
Filing Date:
November 20, 1992
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L21/60; B23K3/06; H01L21/321; H05K3/34; (IPC1-7): H01L21/60; B23K3/06; H05K3/34
Domestic Patent References:
| JP3225832A |
Attorney, Agent or Firm:
Yasuo Sakuta