PURPOSE: To solder a lead wire to a through capacitor using only actually required quantity of wire solder without requiring a large quantity of molten solder in a solder bath.
CONSTITUTION: A wire solder (a) fed from a solder supply section 10 is rolled at a rolling section 20 into a stripe which is pressed against a U-shaped recess in the outer periphery of a roller gear 32 at a molding mechanism section 30 and further pushed in by means of a roller 34 thus forming a U-shaped part on the surface. A cut is then made in the solder depending on the required quantity of solder by means of a cutting roller 36. At a mounting mechanism section 40, lead terminal of through capacitor is inserted into the U-shaped part of the stripe solder (a') and pushed further into the recess by means of a push roller 41 thus winding the stripe solder around the lead terminal L while cutting at the cut. The lead terminal L mounting the stripe solder is then introduced, along with the through capacitor C, into a heating furnace 50 thus reflowing the stripe solder.
HINOHARA SUSUMU
FUKAZAWA TOKUJI
