Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR MACHINING THIN FILM
Document Type and Number:
Japanese Patent JP01149978
Kind Code:
A
Abstract:

PURPOSE: To enable high quality machining with no residue of removed matter by projecting laser beams on a glass substrate having a formed thin film from the substrate side and by vacuum-sucking the substrate from the thin film side.

CONSTITUTION: A thin film 2 for a metal electrode or the like is formed on a substrate 10. Laser beams 60 are projected on the substrate 10 from a position above the substrate 10 and focused on the film 2. The film 2 absorbs the energy of the beams 60 and the projected part of the film 2 is converted into plasma and separated from the substrate 10. At the time. the substrate 10 is vacuum- sucked from the film 2 side. Since a groove 53 for vacuum suction has been cut under a groove as the machined part of the film 2, the separated part drops in the direction of arrows 61 by the synergistic effect of its own weight, a plasma jet and the vacuum suction. Thus, the thin film 2 is machined in a high yield.


Inventors:
Izumo, Masao
Application Number:
JP1987000308643
Publication Date:
June 13, 1989
Filing Date:
December 08, 1987
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K26/00; B23K26/16; C23F4/04; B23K26/00; B23K26/16; C23F4/04; (IPC1-7): B23K26/00; B23K26/16; C23F4/04