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Title:
Method for manufacturing composite sheet for forming protective film, chip with protective film, and chip with protective film
Document Type and Number:
Japanese Patent JP6335173
Kind Code:
B2
Abstract:
A composite sheet for forming a protective film, having: an adhesive sheet having a base material and an adhesive layer and including a cured area inside the adhesive layer; and a film for forming a protective film, which is directly laminated upon the cured area inside the adhesive layer. The adhesive layer comprises an adhesive composition including an energy ray-curable acrylic copolymer having an energy ray-polymerizable group introduced to an acrylic polymer (X) including a vinyl acetate-derived constituent unit (x1). The composite sheet for forming a protective film is capable of producing a chip having a protective film and having: a high suppression effect on the incursion of cutting fluid between the film for forming a protective film (protective film) and the adhesive layer when dicing a workpiece such as a wafer, etc.; excellent aptitude for pick up during chip production; and excellent visibility of a laser printing section on the protective film surface.

Inventors:
Naoki Saeki
Daisuke Yamamoto
Hiroyuki Yoneyama
Takeshi Takano
Application Number:
JP2015529504A
Publication Date:
May 30, 2018
Filing Date:
July 14, 2014
Export Citation:
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Assignee:
LINTEC CORPORATION
International Classes:
H01L21/301; B32B27/30; C09J4/02; C09J7/20; C09J7/22; C09J7/38; C09J11/06; C09J131/04; C09J133/00
Domestic Patent References:
JP2013098408A
JP2011228451A
JP2005281419A
JP2002097436A
Foreign References:
WO2013047674A1
WO2013099869A1
Attorney, Agent or Firm:
Tamotsu Otani
Makoto Kataoka