Title:
導電フィルムの製造方法及び導電フィルム
Document Type and Number:
Japanese Patent JP6664396
Kind Code:
B2
Abstract:
[Problem] To provide: a method for producing a conductive film that exhibits good adhesion to a substrate, high environmental resistance and high scratch resistance; and a conductive film. [Solution] A first resin layer is formed on a substrate using a first resin composition containing a first functional group (S1); after drying the first resin layer to such an extent that a conductive material does not sink into the layer (S2), a conductive pattern that has an opening when viewed in plan is formed on the first resin layer (S3, S4); and a second resin layer is formed so as to cover at least a part of the conductive pattern using a second resin composition containing a second functional group that is co-curable with the first functional group in the first resin layer, and the first resin layer and the second resin layer are co-cured (S5).
Inventors:
Toba Masahiko
Hiroyuki Uchida
Hiroyuki Uchida
Application Number:
JP2017530888A
Publication Date:
March 13, 2020
Filing Date:
July 26, 2016
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
H01B13/00; B32B15/08; C08G18/34; C08G18/83; C08G59/48; C08G65/48; C08L63/00; C08L71/10; C08L75/04; C08L101/02; H01B5/00; H01B5/14
Domestic Patent References:
| JP2015131429A |
Foreign References:
| WO2010082428A1 |
Attorney, Agent or Firm:
Motoji Aihara