Title:
PRODUCTION METHOD OF ELECTRICALLY-CONDUCTIVE BOARD AND ELECTRICALLY-CONDUCTIVE BOARD
Document Type and Number:
Japanese Patent JP2023034082
Kind Code:
A
Abstract:
To provide: a production method of an electrically-conductive board which can easily produce the electrically-conductive board having a silver wiring portion excellent in scratch resistance and a silver wiring portion excellent in a property of connection with an external terminal; and an electrically-conductive board.SOLUTION: A production method of an electrically-conductive board includes the steps of: producing a stack having a substrate, a first silver halide-containing layer which contains silver halide, and a second silver halide-containing layer which contains silver halide having lower sensitivity than the first silver halide-containing layer, in this order; and exposing the stack to light so that there are regions differing in an integrated light-exposure amount to develop an image thereon to form silver wiring.SELECTED DRAWING: Figure 3
Inventors:
ICHIKI AKIRA
Application Number:
JP2021140159A
Publication Date:
March 13, 2023
Filing Date:
August 30, 2021
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
B32B9/00; G06F3/041
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mihashi
Fumio Mihashi