To provide a method of manufacturing a copper-coated polyimide film substrate with few minute dent on a metal layer surface.

The method of manufacturing the copper-coated polyimide film substrate for accumulating a copper layer on a primary metal layer, formed on a surface of a polyimide film by dry plating, by wet plating includes applying, prior to laminating the copper layer using the wet plating, an immersion treatment to immerse the polyimide film or a polyimide film having the primary metal layer formed by the dry plating in an aqueous solution that contains a glycolic acid and a sulfuric acid.