METHOD FOR MANUFACTURING DEVICE PACKAGE - DISCO ABRASIVE SYSTEMS LTD

Title:

METHOD FOR MANUFACTURING DEVICE PACKAGE

Document Type and Number:

Japanese Patent JP2020181876

Kind Code:

A

Abstract:

To provide a method for manufacturing a device package with a sealed side surface and capable of suppressing a processing failure caused by warpage of a wafer and deterioration in processing quality.SOLUTION: A method for manufacturing a device package comprises a preparing step ST1, a first groove forming step ST2, a sealing step ST3, a second groove forming step ST5, and a grinding step ST6. The preparing step prepares a wafer. The first groove forming step forms a first groove having a first width and a depth reaching a finishing thickness of the device package from a surface of the wafer along streets. The sealing step seals the surface of the wafer with a sealing material and buries the first groove with the sealing material. The second groove forming step forms a second groove having a second width narrower than the first width and a depth reaching the finishing thickness from the surface of the wafer along the first groove. The grinding step thins the wafer to the finishing thickness of the device package by grinding a rear surface of the wafer, and forms a plurality of device packages whose side surfaces are sealed by the sealing material.SELECTED DRAWING: Figure 3

Inventors:

CHOONG WAI KIT
ERIC CHENG

Application Number:

JP2019083308A

Publication Date:

November 05, 2020

Filing Date:

April 24, 2019

Export Citation:

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