Title:
METHOD OF MANUFACTURING DIVIDED OBJECT
Document Type and Number:
Japanese Patent JP2002026327
Kind Code:
A
Abstract:
To provide a substrate dividing method by which many small objects can be obtained easily.
An amorphous silicon film containing hydrogen by 8 at% is formed on a glass substrate 1 as a releasable layer 2. On the releasable layer 2, an SiO2 film 31 and a semiconductor element layer 32 are formed as an object 3 to be divided. Then a resistor pattern 4 is formed and the object 3 is dry-etched so that divided bodies 30 may be fixed on the substrate 1 through the releasable layer 2. Thereafter, the divided bodies 30 are released from the releasable layer 2 by projecting an excimer laser beam upon the layer 2 from the substrate 1 side.
Inventors:
NOZAWA RYOICHI
KIMURA MUTSUMI
INOUE SATOSHI
KIMURA MUTSUMI
INOUE SATOSHI
Application Number:
JP2000199981A
Publication Date:
January 25, 2002
Filing Date:
June 30, 2000
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01L21/268; H01L21/02; H01L21/336; H01L27/12; H01L29/786; (IPC1-7): H01L29/786; H01L21/02; H01L21/268; H01L21/336; H01L27/12
Domestic Patent References:
| JPH1124106A | 1999-01-29 | |||
| JPH11142878A | 1999-05-28 | |||
| JPH10125929A | 1998-05-15 | |||
| JP2001007340A | 2001-01-12 |
Attorney, Agent or Firm:
Tetsuya Mori (2 others)