METHOD OF MANUFACTURING EFFECTIVE LAYER INVOLVING AT LEAST ONE SEMICONDUCTOR LAYER

Title:

METHOD OF MANUFACTURING EFFECTIVE LAYER INVOLVING AT LEAST ONE SEMICONDUCTOR LAYER

Document Type and Number:

Japanese Patent JP2003264130

Kind Code:

A

Abstract:

To provide a method of manufacturing an effective layer (2) containing at least a semiconductor layer by separating the effective layer (2) from a carrier (1).

An effective layer (2) is formed on a carrier (1), a subsidiary carrier (3) is formed on the opposite side of the effective layer (2) to the carrier (1) with a bond layer (4), advantageously a bond layer (4) having a metal material at a bonding temperature, and the carrier (1) is mechanically peeled off at a temperature higher or equal to the bonding temperature of the bond layer but lower than the melting temperature whereby at least a part of the effective layer is peeled off, together with the subsidiary carrier layer (3).

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Inventors:

PLOESSL ANDREAS
HAHN BERTHOLD
EISERT DOMINIK
KAISER STEPHAN

Application Number:

JP2002366978A

Publication Date:

September 19, 2003

Filing Date:

December 18, 2002

Export Citation:

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Assignee:

OSRAM OPTO SEMICONDUCTORS GMBH

International Classes:

H01L33/32; H01L21/02; H01L21/20; H01L33/34; (IPC1-7): H01L21/02; H01L33/00

Attorney, Agent or Firm:

Toshio Yano (4 outside)

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